Hole specifications
Plated through-hole according to IEC 60352-5
| PC/104-Plus | PC/104, socket connector, VarPol | |||
| Nominal hole | Ø 0.85 mm | Ø 1.0 mm | ||
| imm. Sn printed circuit boards | ||||
 | A | PCB thickness | min. 1.4 mm | min. 1.4 mm |
| B | Plated hole | Ø 0.85 +0.09/-0.00 mm | Ø 1 +0.09/-0.00 mm | |
| C | Drill hole | 1.0 ±0.025 mm | 1.15 ±0.025 mm | |
| D | Cu plating | min. 25 µm | min. 25 µm | |
| E | imm. Sn plating | max. 1.5 µm | max. 1.5 µm | |
| F | Annular ring | min. 0.1 mm | min. 0.1 mm | |
| Ni, Au printed circuit boards | ||||
| A | PCB thickness | min. 1.4 mm | min. 1.4 mm | |
| B | Plated hole | Ø 0.85 +0.09/-0.00 mm | Ø 1 +0.09/-0.00 mm | |
| C | Drill hole | 1.0 ±0.025 mm | 1.15 ±0.025 mm | |
| D | Cu plating | min. 25 µm | min. 25 µm | |
| E | Ni, Au plating | 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni | 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni | |
| F | Annular ring | min. 0.1 mm | min. 0.1 mm | |
| pure Cu printed circuit boards | ||||
| A | PCB thickness | min. 1.4 mm | min. 1.4 mm | |
| B | Plated hole | Ø 0.85 +0.09/-0.00 mm | Ø 1 +0.09/-0.04 mm | |
| C | Drill hole | 1.0 ±0.025 mm | 1.15 ±0.025 mm | |
| D | Cu plating | min. 25 µm | min. 25 µm | |
| E | OSP* | z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm | z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm | |
| F | Annular ring | min. 0.1 mm | min. 0.1 mm | |
| HAL Sn printed circuit boards | ||||
| A | PCB thickness | min. 1.4 mm | min. 1.4 mm | |
| B | Plated hole | Ø 0.85 +0.09/-0.02 mm | Ø 1 +0.09/-0.06 mm | |
| C | Drill hole | 1.0 ±0.025 mm | 1.15 ±0.025 mm | |
| D | Cu plating | min. 25 µm | min. 25 µm | |
| E | HAL Sn | 5 - 15 µm | 5 - 15 µm | |
| F | Annular ring | min. 0.1 mm | min. 0.1 mm | |
* OSP = Organic Solderability Preservatives